Time for another informative FAQ session with Electronic Design – and this time, we’re talking BiCS FLASH™! When it comes to storing, analyzing and moving massive amounts of data, our BiCS FLASH is up to the task – all while consuming less power, improving endurance, increasing power efficiency and offering higher density in a smaller footprint (when compared to floating gate technology).
What is 3D flash memory, exactly? Have you ever wondered what the difference between bonded and through-silicon via (TSV) approaches is? What about the controller used for 3D flash memory as compared to what is used in floating gate? We discussed all of this and more – including what’s next for 3D flash memory – with Bill Wong. Get all of the answers here:
http://www.toshiba.com/taec/adinfo/technologymoves/pdfs/SM_Toshiba_BiCS.pdf
BiCS FLASH is a trademark of Toshiba Corporation
Disclaimer
The views and opinions expressed in this blog are those of the author(s) and do not necessarily reflect those of KIOXIA America, Inc.