Introducing KIOXIA’s new sixth-generation 3D flash memory: our 162-layer BiCS FLASHTM represents a new approach to 3D flash memory scaling that delivers the performance, reliability and cost needed to meet customer demand. Our latest BiCS FLASH technology introduction makes use of a wide range of technology and manufacturing innovations that enable it to achieve greater capacity through lateral density scaling - not just by increasing layers.
Advanced architecture beyond conventional eight-stagger memory hole array allows this new technology to achieve up to 10% greater lateral cell array density compared to the fifth-generation technology. This lateral scaling advancement, in combination with 162 layers of stacked vertical memory, enables a 40% reduction in die size compared to the 112-layer stacking technology - optimizing cost.
When comparing industry 3D generation offerings, bigger, or taller, isn’t always better. Being a leader in 3D flash memory is not defined by the highest number of layers. Those who can deliver density and performance increases - in the fewest number of layers - and optimize die size will have the most competitive, cost-efficient solution.
Our latest BiCS FLASH introduction is yet another indicator that KIOXIA is leading the way forward for 3D.
All company names, product names and service names may be trademarks of their respective companies.
Disclaimer
The views and opinions expressed in this blog are those of the author(s) and do not necessarily reflect those of KIOXIA America, Inc.